Mac Pro 5,1
and Mac Pro 4,1 single processor
Mac Pro 5,1 and Mac Pro 4,1 with one processor, require Intel Xeon processors for LGA 1366 (Socket B).
In order for the Mac Pro 4,1 to see new processors, you need to make its firmware upgrade to version 5,1.
Mac Pro 4,1
dual-processors
The Macintosh Mac Pro 4.1 with a dual-processor mainboard has an LGA 1366 socket, but it is factory modified and adapted for Intel Xeon processors without a metal IHS tile (delid). Attempting to mount the processor with IHS may result in damage to the processor itself or the board with electronic components.
An additional fact is the electronic socket connecting the heat sink with the motherboard. It allows, among others, to measure temperatures. Only processors without an IHS tile ensure proper contact of these elements.
We offer microprocessors dedicated to the dual-processor Mac Pro 4.1 and the IHS image service itself from the microprocessors entrusted by the client.
In order for the Mac Pro 4,1 to see new processors, you need to make its firmware upgrade to version 5,1.
mirrored core purity
We are the only company in Europe
that offers Intel Xeon processors without IHS,
having mirror-clean cores
Processors
Intel Xeon for Mac Pro 4,1 and Mac Pro 5,1
Xeon 5670
- # of Cores 6
- # of Threads 12
- Processor Base Frequency 2.93 GHz
- Max Turbo Frequency 3.33 GHz
- Cache 12 MB SmartCache
- TCASE (max. temp. allowed at the IHS) 81°C
- TDP 95 W
Xeon 5670 – an option for people who want to modernize the computer, but not demanding the highest parameters. The processor retains all the advantages of the Xeon 5675 processor, giving it a slight speed (2.93 vs 3.06 GHz).
Xeon 5675
- # of Cores 6
- # of Threads 12
- Processor Base Frequency 3.06 GHz
- Max Turbo Frequency 3.46 GHz
- Cache 12 MB SmartCache
- TCASE (max. temp. allowed at the IHS) 81°C
- TDP 95 W
Xeon 5675 – in addition to the slightly lower clock speed of the Xeon 5690, the processor distinguishes TDP 95 watts and higher permissible temperature on the IHS.
Xeon 5680
- # of Cores 6
- # of Threads 12
- Processor Base Frequency 3.33 GHz
- Max Turbo Frequency 3.60 GHz
- Cache 12 MB SmartCache
- TCASE (max. temp. allowed at the IHS) 78,5°C
- TDP 130 W
Xeon 5680 – practically the only difference between X5680 and X5690 is clock speed (3.33 vs 3.46 GHz). The other parameters are identical or very similar.
Xeon 5690
- # of Cores 6
- # of Threads 12
- Processor Base Frequency 3.46 GHz
- Max Turbo Frequency 3.73 GHz
- Cache 12 MB SmartCache
- TCASE (max. temp. allowed at the IHS) 78,5°C
- TDP 130 W
Xeon 5690 – microprocessor clocked at 3.46 GHz. The strongest CPU for the LGA 1366 slot, which are equipped with Mac Pro 5.1 and Mac Pro 4.1. The processor has a TDP of 130 watts, which requires careful monitoring of core temperatures during operations using simultaneous operation of all cores (eg 3D rendering).
Performance tests
1. Geekbench
Macintosh with two microprocessors
Macintosh with one microprocessor
The charts were made on the basis of measurements placed on the www.geekbench.com website. Within the same types of computers equipped with the same microprocessor, the test results depend on additional computer components (e.g. type and size of RAM) as well as peripheral devices attached. For a more accurate performance analysis, it is a good idea to familiarize yourself with the specific measurements posted on this website.
2. Cinebench
Cinebench is a real-world cross-platform test suite that evaluates your computer’s hardware capabilities. Improvements to Cinebench Release 20 reflect the overall advancements to CPU and rendering technology in recent years, providing a more accurate measurement of Cinema 4D’s ability to take advantage of multiple CPU cores and modern processor features available to the average user.
Cinebench can measure systems with up to 256 processor threads. This test scene contains approximately 2,000 objects which in turn contain more than 300,000 polygons in total, and uses sharp and blurred reflections, area lights, shadows, procedural shaders, antialiasing, and much more. The result is displayed in points (pts). The higher the number, the faster your processor.
GLOSSARY
TDP (Thermal Design Power) – the maximum amount of heat to be removed from the processor. The higher the TDP, the processor emits more heat, which in turn drains the heat sink mounted on the processor. Emitted heat is dependent on the intensity of the cores. The more cores will work simultaneously, the more heat will appear. This is a particularly important parameter when thinking about the use of all cores requiring simultaneous operation, i.e. for example 3D renderings.
The TDP of a CPU has been underestimated in some cases, leading to certain real applications (typically strenuous, such as video encoding or games) causing the CPU to exceed its specified TDP and resulting in overloading the computer’s cooling system. In this case, CPUs either cause a system failure (a “therm-trip”) or throttle their speed down.
TCase – maximum allowable temperature on the processor’s IHS.
IHS (integrated heatspreaders) – a metal plate usually made of aluminum or copper, covering the core of the processor.
Multi-core processor – a single computing component with two or more independent processing units called cores, which read and execute program instructions. Single processor can run multiple instructions on separate cores at the same time, increasing overall speed for programs amenable to parallel computing. Manufacturers typically integrate the cores onto a single integrated circuit die (known as a chip multiprocessor or CMP) or onto multiple dies in a single chip package.
Thermal grease (also called CPU grease, heat paste, heat sink compound, heat sink paste, thermal compound, thermal gel, thermal interface material, or thermal paste) is a thermally conductive (but usually electrically insulating) compound, which is commonly used as an interface between heat sinks and heat sources (e.g., high-power semiconductor devices). The main role of thermal grease is to eliminate air gaps or spaces (which act as thermal insulator) from the interface area in order to maximize heat transfer.